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      Question

      India's first advanced 3D glass semiconductor packaging

      unit in Odisha is being implemented by which US-based company through its Indian subsidiary?
      A Intel Corporation Correct Answer Incorrect Answer
      B Advanced Micro Devices Correct Answer Incorrect Answer
      C 3D Glass Solutions Inc. Correct Answer Incorrect Answer
      D Nvidia Corporation Correct Answer Incorrect Answer
      E Qualcomm Incorporated Correct Answer Incorrect Answer

      Solution

      The project is being implemented by 3D Glass Solutions Inc. (3DGS), USA, through its wholly owned Indian subsidiary Heterogeneous Integration Packaging Solutions Private Limited (HIPSPL). Once operational, the unit is projected to produce 70,000 glass panels, 50 million assembled units and around 13,000 advanced 3DHI modules annually.

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