Question
India's first advanced 3D glass semiconductor packaging
unit was launched in Odisha. What is the total investment for this project and what is the Central government's contribution under the India Semiconductor Mission?Solution
The project is being implemented by 3D Glass Solutions Inc. (USA) through its Indian subsidiary HIPSPL. The total outlay is approximately Rs. 1,943.53 crore, supported by Central (Rs. 799 crore) and State fiscal incentives (Rs. 399.5 crore) under the India Semiconductor Mission. Commercial production is slated to begin by August 2028.
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